Wireless chip to chip communication link budget enhancement using hard/soft surfaces

Yazan Al-Alem; Ahmed A. Kishk; Raed Shubair

doi:10.1109/GlobalSIP.2018.8646429

Wireless chip to chip communication link budget enhancement using hard/soft surfaces

Yazan Al-Alem
, Ahmed A. Kishk
, Raed Shubair

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

This paper investigates the use of hard/soft surface concept to improve the link budget of a wireless inter-chip communication link. The use of such surfaces is employed to focus the radiated power from the transmitter towards the receiver. As a result of employing the hard/soft surfaces a significant improvement in the link budget of a wireless chip to chip communication link is improved.

Original language	English
Title of host publication	2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1013-1014
Number of pages	2
ISBN (Electronic)	9781728112954
DOIs	https://doi.org/10.1109/GlobalSIP.2018.8646429
State	Published - 2 Jul 2018
Externally published	Yes

Publication series

Name	2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

Keywords

Soft and hard surfaces.
Wireless inter/intra-chip communication

ASJC Scopus subject areas

Information Systems
Signal Processing

Access to Document

10.1109/GlobalSIP.2018.8646429

Cite this

Al-Alem, Y., Kishk, A. A., & Shubair, R. (2018). Wireless chip to chip communication link budget enhancement using hard/soft surfaces. In 2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings (pp. 1013-1014). Article 8646429 (2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/GlobalSIP.2018.8646429

Al-Alem, Yazan ; Kishk, Ahmed A. ; Shubair, Raed. / Wireless chip to chip communication link budget enhancement using hard/soft surfaces. 2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1013-1014 (2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings).

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title = "Wireless chip to chip communication link budget enhancement using hard/soft surfaces",

abstract = "This paper investigates the use of hard/soft surface concept to improve the link budget of a wireless inter-chip communication link. The use of such surfaces is employed to focus the radiated power from the transmitter towards the receiver. As a result of employing the hard/soft surfaces a significant improvement in the link budget of a wireless chip to chip communication link is improved.",

keywords = "Soft and hard surfaces., Wireless inter/intra-chip communication",

author = "Yazan Al-Alem and Kishk, \{Ahmed A.\} and Raed Shubair",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.",

year = "2018",

month = jul,

day = "2",

doi = "10.1109/GlobalSIP.2018.8646429",

language = "English",

series = "2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1013--1014",

booktitle = "2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings",

address = "United States",

}

Al-Alem, Y, Kishk, AA & Shubair, R 2018, Wireless chip to chip communication link budget enhancement using hard/soft surfaces. in 2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings., 8646429, 2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 1013-1014. https://doi.org/10.1109/GlobalSIP.2018.8646429

Wireless chip to chip communication link budget enhancement using hard/soft surfaces. / Al-Alem, Yazan; Kishk, Ahmed A.; Shubair, Raed.
2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1013-1014 8646429 (2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Al-Alem, Yazan

AU - Kishk, Ahmed A.

AU - Shubair, Raed

PY - 2018/7/2

Y1 - 2018/7/2

N2 - This paper investigates the use of hard/soft surface concept to improve the link budget of a wireless inter-chip communication link. The use of such surfaces is employed to focus the radiated power from the transmitter towards the receiver. As a result of employing the hard/soft surfaces a significant improvement in the link budget of a wireless chip to chip communication link is improved.

AB - This paper investigates the use of hard/soft surface concept to improve the link budget of a wireless inter-chip communication link. The use of such surfaces is employed to focus the radiated power from the transmitter towards the receiver. As a result of employing the hard/soft surfaces a significant improvement in the link budget of a wireless chip to chip communication link is improved.

KW - Soft and hard surfaces.

KW - Wireless inter/intra-chip communication

UR - https://www.scopus.com/pages/publications/85063109381

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DO - 10.1109/GlobalSIP.2018.8646429

M3 - Conference contribution

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T3 - 2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings

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BT - 2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Al-Alem Y, Kishk AA, Shubair R. Wireless chip to chip communication link budget enhancement using hard/soft surfaces. In 2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1013-1014. 8646429. (2018 IEEE Global Conference on Signal and Information Processing, GlobalSIP 2018 - Proceedings). doi: 10.1109/GlobalSIP.2018.8646429

Wireless chip to chip communication link budget enhancement using hard/soft surfaces

Abstract

Publication series

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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Cite this