Transformational silicon electronics

Jhonathan Prieto Rojas, Galo Andres Torres Sevilla, Mohamed Tarek Ghoneim, Salman Bin Inayat, Sally M. Ahmed, Aftab Mustansir Hussain, Muhammad Mustafa Hussain*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

79 Scopus citations

Abstract

In today's traditional electronics such as in computers or in mobile phones, billions of high-performance, ultra-low-power devices are neatly integrated in extremely compact areas on rigid and brittle but low-cost bulk monocrystalline silicon (100) wafers. Ninety percent of global electronics are made up of silicon. Therefore, we have developed a generic low-cost regenerative batch fabrication process to transform such wafers full of devices into thin (5 μm), mechanically flexible, optically semitransparent silicon fabric with devices, then recycling the remaining wafer to generate multiple silicon fabric with chips and devices, ensuring low-cost and optimal utilization of the whole substrate. We show monocrystalline, amorphous, and polycrystalline silicon and silicon dioxide fabric, all from low-cost bulk silicon (100) wafers with the semiconductor industry's most advanced high-κ/metal gate stack based high-performance, ultra-low-power capacitors, field effect transistors, energy harvesters, and storage to emphasize the effectiveness and versatility of this process to transform traditional electronics into flexible and semitransparent ones for multipurpose applications.

Original languageEnglish
Pages (from-to)1468-1474
Number of pages7
JournalACS Nano
Volume8
Issue number2
DOIs
StatePublished - 25 Feb 2014
Externally publishedYes

Keywords

  • MIMCAP
  • MOSCAP
  • MOSFET
  • flexible electronics
  • silicon (100)
  • μLIB

ASJC Scopus subject areas

  • General Materials Science
  • General Engineering
  • General Physics and Astronomy

Fingerprint

Dive into the research topics of 'Transformational silicon electronics'. Together they form a unique fingerprint.

Cite this