Abstract
Location information plays an important role in most of the applications in Wireless Sensor Network (WSN). Recently, many localization techniques have been proposed, while most of these deals with two Dimensional applications. Whereas, in Three Dimensional applications the task is complex and there are large variations in the altitude levels. In these 3D environments, the sensors are placed in mountains for tracking and deployed in air for monitoring pollution level. For such applications, 2D localization models are not reliable. Due to this, the design of 3D localization systems in WSNs faces new challenges. In this paper, in order to find unknown nodes in Three-Dimensional environment, only single anchor node is used. In the simulation-based environment, the nodes with unknown locations are moving at middle & lower layers whereas the top layer is equipped with single anchor node. A novel soft computing technique namely Adaptive Plant Propagation Algorithm (APPA) is introduced to obtain the optimized locations of these mobile nodes. These mobile target nodes are heterogeneous and deployed in an anisotropic environment having an Irregularity (Degree of Irregularity (DOI)) value set to 0.01. The simulation results present that proposed APPA algorithm outperforms as tested among other meta-heuristic optimization techniques in terms of localization error, computational time, and the located sensor nodes.
| Original language | English |
|---|---|
| Pages (from-to) | 305-321 |
| Number of pages | 17 |
| Journal | Computers, Materials and Continua |
| Volume | 70 |
| Issue number | 1 |
| DOIs | |
| State | Published - 2021 |
| Externally published | Yes |
Bibliographical note
Publisher Copyright:© 2021 Tech Science Press. All rights reserved.
Keywords
- Adaptive plant propagation algorithm
- Biogeography-based optimization
- Firefly algorithm
- Grey Wolf optimizer
- H-best particle swarm optimization
- Localization
- Particle swarm optimization
- Wireless sensor networks
ASJC Scopus subject areas
- Biomaterials
- Modeling and Simulation
- Mechanics of Materials
- Computer Science Applications
- Electrical and Electronic Engineering
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