Thermal stress distributions and microstructure in laser cutting of thin Al-Si alloy sheet

Syed Sohail Akhtar, Bekir Sami Yilbas, Emin Bayraktar

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

In the present study, laser cutting of thin aluminium-silicon alloy sheet is carried out and the temperature and stress fields are predicted using the finite element code. Surface temperature predictions are validated with the thermocouple data. The changes and geometric features of the cut sections are examined through scanning electron microscope, energy dispersive spectroscopy, and x-ray diffraction. It is found that the high conductivity of aluminum-silicon alloy increases the cooling rates and influences the thermal stress field in the cutting section. The striation patterns are formed at the kerf surface and some small dross attachments are observed at the cut edges.

Original languageEnglish
Article number042006
JournalJournal of Laser Applications
Volume25
Issue number4
DOIs
StatePublished - Aug 2013

Bibliographical note

Funding Information:
The author would like to acknowledge the support of King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia.

Keywords

  • Al-Si alloy
  • finite element analysis
  • laser
  • residual stress

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Biomedical Engineering
  • Instrumentation

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