Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison

Hafiz Muhammad Ali; Adeel Arshad; Mark Jabbal; P. G. Verdin

doi:10.1016/j.ijheatmasstransfer.2017.10.065

Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison

Hafiz Muhammad Ali^*, Adeel Arshad, Mark Jabbal, P. G. Verdin

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

219 Scopus citations

Abstract

The present paper covers the comparison of two different configurations (square and circular) pin-fin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2mm square and 3mm circular fin thickness of constant volume fraction of 9% are chosen and input heat fluxes from 1.2kW/m² to 3.2kW/m² with an increment of 0.4kW/m² are provided. Two different critical set point temperatures (SPTs) 45°C and 65°C are chosen to explore the thermal performance in terms of enhancement ratios, enhancement in operation time, latent heating phase duration, thermal capacity and conductance. The results show that 3mm diameter of circular pin-fins has the best thermal performance in passive thermal management of electronic devices.

Original language	English
Pages (from-to)	1199-1204
Number of pages	6
Journal	International Journal of Heat and Mass Transfer
Volume	117
DOIs	https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.065
State	Published - Feb 2018
Externally published	Yes

Bibliographical note

Publisher Copyright:
© 2017 Elsevier Ltd

Keywords

Paraffin wax
Phase change materials (PCMs)
Pin-fin heat sinks
Set point temperatures (SPTs)
Thermal conductivity enhancers (TCEs)
n-Eicosane

ASJC Scopus subject areas

Condensed Matter Physics
Mechanical Engineering
Fluid Flow and Transfer Processes

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10.1016/j.ijheatmasstransfer.2017.10.065

Cite this

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title = "Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison",

abstract = "The present paper covers the comparison of two different configurations (square and circular) pin-fin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2mm square and 3mm circular fin thickness of constant volume fraction of 9\% are chosen and input heat fluxes from 1.2kW/m2 to 3.2kW/m2 with an increment of 0.4kW/m2 are provided. Two different critical set point temperatures (SPTs) 45°C and 65°C are chosen to explore the thermal performance in terms of enhancement ratios, enhancement in operation time, latent heating phase duration, thermal capacity and conductance. The results show that 3mm diameter of circular pin-fins has the best thermal performance in passive thermal management of electronic devices.",

keywords = "Paraffin wax, Phase change materials (PCMs), Pin-fin heat sinks, Set point temperatures (SPTs), Thermal conductivity enhancers (TCEs), n-Eicosane",

author = "Ali, \{Hafiz Muhammad\} and Adeel Arshad and Mark Jabbal and Verdin, \{P. G.\}",

note = "Publisher Copyright: {\textcopyright} 2017 Elsevier Ltd",

year = "2018",

month = feb,

doi = "10.1016/j.ijheatmasstransfer.2017.10.065",

language = "English",

volume = "117",

pages = "1199--1204",

journal = "International Journal of Heat and Mass Transfer",

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T2 - A comparison

AU - Ali, Hafiz Muhammad

AU - Arshad, Adeel

AU - Jabbal, Mark

AU - Verdin, P. G.

PY - 2018/2

Y1 - 2018/2

N2 - The present paper covers the comparison of two different configurations (square and circular) pin-fin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2mm square and 3mm circular fin thickness of constant volume fraction of 9% are chosen and input heat fluxes from 1.2kW/m2 to 3.2kW/m2 with an increment of 0.4kW/m2 are provided. Two different critical set point temperatures (SPTs) 45°C and 65°C are chosen to explore the thermal performance in terms of enhancement ratios, enhancement in operation time, latent heating phase duration, thermal capacity and conductance. The results show that 3mm diameter of circular pin-fins has the best thermal performance in passive thermal management of electronic devices.

AB - The present paper covers the comparison of two different configurations (square and circular) pin-fin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2mm square and 3mm circular fin thickness of constant volume fraction of 9% are chosen and input heat fluxes from 1.2kW/m2 to 3.2kW/m2 with an increment of 0.4kW/m2 are provided. Two different critical set point temperatures (SPTs) 45°C and 65°C are chosen to explore the thermal performance in terms of enhancement ratios, enhancement in operation time, latent heating phase duration, thermal capacity and conductance. The results show that 3mm diameter of circular pin-fins has the best thermal performance in passive thermal management of electronic devices.

KW - Paraffin wax

KW - Phase change materials (PCMs)

KW - Pin-fin heat sinks

KW - Set point temperatures (SPTs)

KW - Thermal conductivity enhancers (TCEs)

KW - n-Eicosane

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DO - 10.1016/j.ijheatmasstransfer.2017.10.065

M3 - Article

AN - SCOPUS:85032267958

SN - 0017-9310

VL - 117

SP - 1199

EP - 1204

JO - International Journal of Heat and Mass Transfer

JF - International Journal of Heat and Mass Transfer

ER -

Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

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