Skip to main navigation Skip to search Skip to main content

Thermal case study of nanofluid flow in partially heated rectangular enclosure rooted with sinusoidal heated rods and inclined magnetic field

  • Khalil Ur Rehman*
  • , Wasfi Shatanawi*
  • , Haitham M.S. Bahaidarah
  • , Safdar Abbas
  • , A. U. Khan
  • *Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

The natural convection nanofluid flow in a partially heated rectangular enclosure is studied numerically. For better novelty, an inclined magnetic field is carried externally. The wavy heated rods are installed at both the bottom and upper walls of an enclosure. Copper-Oxide (CuO) nanoparticles are suspended in the flow field. The nanofluid flow is mathematically formulated in terms of differential equations. The finite element method is used to examine the flow field in a partially heated rectangular enclosure. The flow-affecting parameters are Hartmann number and angle of inclination. The quantity of interest includes horizontal velocity, vertical velocity, and Nusselt number. The outcomes are shared in terms of contour and line plots. It is observed that for increasing values of the Hartmann number, the Nusselt number at the upper heated sinusoidal rod shows a higher magnitude in comparison with a lower heated corrugated rod.

Original languageEnglish
Article number102982
JournalCase Studies in Thermal Engineering
Volume45
DOIs
StatePublished - May 2023

Bibliographical note

Publisher Copyright:
© 2023 The Authors

Keywords

  • Heat transfer
  • MHD
  • Nanofluid
  • Natural convection
  • Partially heated enclosure
  • Sinusoidal heated rods

ASJC Scopus subject areas

  • Engineering (miscellaneous)
  • Fluid Flow and Transfer Processes

Fingerprint

Dive into the research topics of 'Thermal case study of nanofluid flow in partially heated rectangular enclosure rooted with sinusoidal heated rods and inclined magnetic field'. Together they form a unique fingerprint.

Cite this