Abstract
Silicon Rubber (SIR) is one of the most popular polymeric materials used in various insulation processes, such as the insulation of high voltage cables. But like other polymers, it has some disadvantages, so TiO2 was added as a filler to improve some SIR properties, such as electrical and performance properties, and increasing the dielectric strength. Six SIR samples were prepared with TIO2 filler at percentages (100: 0, 90:10, 80:20, 70:30, 60:40, and 50:50) %. Dielectric strength tests were performed. To obtain the most accurate and best results, the Supply demand- based optimization (SDO) algorithm was performed that is one of the modem methods similar to the mechanism of supply and demand in the economy. The obtained results of the proposed SDO technique is compared with the recent Movable damped wave algorithm (MDWA). The SDO technique was a fast and effective algorithm at finding the optimum values of the percentage of SIR/TiO2 fillers parameter under different conditions comparing with the MDWA algorithm. Eventually, the dielectric strength improved with increasing TiO2 content and the best filler sample according to this principle 60/40% SIR/ TiO2 filler sample as the dielectric increased by approximately 43.72% KV/mm.
| Original language | English |
|---|---|
| Title of host publication | 2021 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, CHILECON 2021 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9781665408738 |
| DOIs | |
| State | Published - 2021 |
| Event | 2021 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, CHILECON 2021 - Virtual, Online, Chile Duration: 6 Dec 2021 → 9 Dec 2021 |
Publication series
| Name | 2021 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, CHILECON 2021 |
|---|
Conference
| Conference | 2021 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies, CHILECON 2021 |
|---|---|
| Country/Territory | Chile |
| City | Virtual, Online |
| Period | 6/12/21 → 9/12/21 |
Bibliographical note
Publisher Copyright:© 2021 IEEE.
Keywords
- dielectric strength
- Movable damped wave algorithm
- Polymers
- SIR/TiO2 fillers
- Supply demand- based optimization
ASJC Scopus subject areas
- Artificial Intelligence
- Computer Networks and Communications
- Hardware and Architecture
- Information Systems
- Information Systems and Management
- Energy Engineering and Power Technology
- Electrical and Electronic Engineering
- Control and Optimization
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