TY - GEN
T1 - Study of a BIST technique for CMOS active pixel sensors
AU - Lizarraga, L.
AU - Mir, S.
AU - Sicard, G.
AU - Bounceur, A.
PY - 2006
Y1 - 2006
N2 - The production test of CMOS image sensors is complicated and expensive as an electrical and an optical test must be executed for the pixel matrix. In this paper we study a Built-In-Self-Test (BIST) technique for the pixels. The technique is based on applying a voltage stimulus at the photosensitive element of the image sensor. The aim of this work is to avoid light stimuli to realise an only electrical test to determine if a pixel is functional or not. This will then reduce test time and test cost. To quantify the quality of this test approach, test metrics such as fault rejection and fault acceptance are estimated. Catastrophic and parametric faults are taken into consideration for the estimation of the test quality.
AB - The production test of CMOS image sensors is complicated and expensive as an electrical and an optical test must be executed for the pixel matrix. In this paper we study a Built-In-Self-Test (BIST) technique for the pixels. The technique is based on applying a voltage stimulus at the photosensitive element of the image sensor. The aim of this work is to avoid light stimuli to realise an only electrical test to determine if a pixel is functional or not. This will then reduce test time and test cost. To quantify the quality of this test approach, test metrics such as fault rejection and fault acceptance are estimated. Catastrophic and parametric faults are taken into consideration for the estimation of the test quality.
UR - https://www.scopus.com/pages/publications/46249129966
U2 - 10.1109/VLSISOC.2006.313255
DO - 10.1109/VLSISOC.2006.313255
M3 - Conference contribution
AN - SCOPUS:46249129966
SN - 3901882197
SN - 9783901882197
T3 - IFIP VLSI-SoIC 2006 - IFIP WG 10.5 International Conference on Very Large Scale Integration and System-on-Chip
SP - 326
EP - 331
BT - IFIP VLSI-SoIC 2006 - IFIP WG 10.5 International Conference on Very Large Scale Integration and System-on-Chip
T2 - IFIP WG 10.5 International Conference on Very Large Scale Integration and System-on-Chip, VLSI-SoIC 2006
Y2 - 16 October 2006 through 18 October 2006
ER -