Abstract
We report fabrication of MEMS thermal actuators on flexible and semi-transparent silicon fabric released from bulk silicon (100). We fabricated the devices first and then released the top portion of the silicon (≈ 19 μm) which is flexible and semi-transparent. We also performed chemical mechanical polishing to reuse the remaining wafer. A tested thermal actuator with 3 μm wide 240 μm hot arm and 10 μm wide 185 μm long cold arm deflected by 1.7 μm at 1 V. The fabricated thermal actuators exhibit similar performance before and after bending. We believe the demonstrated process will expand the horizon of flexible electronics into MEMS world devices.
| Original language | English |
|---|---|
| Title of host publication | MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 548-551 |
| Number of pages | 4 |
| ISBN (Print) | 9781479935086 |
| DOIs | |
| State | Published - 2014 |
| Externally published | Yes |
Publication series
| Name | Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) |
|---|---|
| ISSN (Print) | 1084-6999 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
Keywords
- Flexible electronics
- Sacrificial layer
- Structural layer
- Thermal flexure actuator
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Mechanical Engineering
- Electrical and Electronic Engineering
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