Abstract
Silicon fillers have recently been employed as a multifunctional material to improve polymer composites' dielectric strength and mechanical strength, widely used to fabricate high-performance structural components. However, the mechanical strength was altered by adding silicon filler particles, leading to machining challenges that caused issues with quality and surface characteristics due to brittle fracture of silicon particles and related damage. The silicon filler 0, 3, 5, and 10% filled polymer matrix glass fibre reinforced composite was fabricated, and then abrasive water jet machining was used to investigate the machinability of the fabricated composite by considering silicon concentration, water jet pressure (WP), standoff distance (ND), traverse speed (ST). The machinability of the composite was established for quality-affecting responses such as kerf taper angle (KTA) and surface roughness (Ra). Silicon-filled polymer composites exhibit a higher dielectric constant than epoxy-glass fibre composites. An increase in silicon filler fraction decreases the surface roughness (Ra) and kerf taper angle (KTA), specifically at 5% of silicon filler, resulting in better machining quality. In contrast, 10% silicon filler increases those two responses to a high level, resulting in lower usage in considered applications due to more direct interaction between silicon filler and garnet abrasive grains. Increasing water jet pressure (WP) and decreasing standoff distance (ND) and traverse speed (ST) improve the machinability of silicon-filled composites. An SEM study of the surface topography reveals smooth cutting and finishing at high water jet pressure (WP) and 5% silicon particles.
| Original language | English |
|---|---|
| Pages (from-to) | 1339-1356 |
| Number of pages | 18 |
| Journal | Journal of Inorganic and Organometallic Polymers and Materials |
| Volume | 33 |
| Issue number | 5 |
| DOIs | |
| State | Published - May 2023 |
| Externally published | Yes |
Bibliographical note
Publisher Copyright:© 2023, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.
Keywords
- Boron doped silicon wafer
- Dielectric
- Epoxy
- Erosion
- Polymer composite
- Silicon filler
- Water jet machining
ASJC Scopus subject areas
- Polymers and Plastics
- Materials Chemistry
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