PR-PUF: A Reconfigurable Strong RRAM PUF

  • Gokulnath Rajendran*
  • , Furqan Zahoor*
  • , Simranjeet Singh
  • , Farhad Merchant
  • , Vikas Rana
  • , Anupam Chattopadhyay*
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Physical Unclonable Functions (PUFs) offer the natural advantage of built-in key generation, thus eliminating the costly process of embedding unique key after manufacturing millions of integrated circuits. When PUFs are deployed for the application, all the Challenge-Response Pairs (CRP) are collected and stored in a trusted server, and the responses are compared with the one from the device during the run-time - forming the crux of various security protocols. Two issues are commonly faced during PUF designs. First, to enhance the applicability of PUF, larger set of CRP is desirable, which is referred to as a strong PUF. Second, due to the emergence of machine learning-based PUF modelling attacks, it is now imperative to have a PUF demonstrating resistance against such attacks. In this paper, we propose a novel Parity Resistive RAM PUF (PR-PUF) implemented using RRAM crossbar architecture. PR-PUF supports low-overhead reconfiguration, where both the original and reconfigured CRP space enhances the CRP size, with average uniqueness between reconfiguration of 49.98%. The construction also demonstrates excellent robustness against various modeling attacks. We present detailed design analysis and circuit-level simulation studies.

Original languageEnglish
Title of host publication2023 IFIP/IEEE 31st International Conference on Very Large Scale Integration, VLSI-SoC 2023
PublisherIEEE Computer Society
ISBN (Electronic)9798350325997
DOIs
StatePublished - 2023
Externally publishedYes
Event31st IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023 - Dubai, United Arab Emirates
Duration: 16 Oct 202318 Oct 2023

Publication series

NameIEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC
ISSN (Print)2324-8432
ISSN (Electronic)2324-8440

Conference

Conference31st IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023
Country/TerritoryUnited Arab Emirates
CityDubai
Period16/10/2318/10/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 9 - Industry, Innovation, and Infrastructure
    SDG 9 Industry, Innovation, and Infrastructure

Keywords

  • PUF
  • RRAM
  • Security

ASJC Scopus subject areas

  • Hardware and Architecture
  • Software
  • Electrical and Electronic Engineering

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