Phase Change Material Applications in Thermal Management of Electronics and Electrical Systems

The escalating power densities and shrinking size of electronic devices present formidable challenges in achieving effective thermal management, particularly for high-performance chips. The failure rate of electronic devices exhibits an exponential rise with escalating operating temperatures. The prevailing design trend in modern electronics, characterized by smaller and faster components, engenders elevated power densities, heightened operating temperatures, and compromised performance and longevity of electronic devices. In light of these challenges, researchers have been actively investigating the applicability of phase change materials in electronic cooling. This chapter provides an exposition of these materials as a prospective solution for electronic cooling, with a particular focus on passive and hybrid cooling methodologies. Passive cooling methods include phase change material-enhanced heat sinks, heat pipes, and phase change material-integrated thermal interface materials. Hybrid cooling systems, on the other hand, involve the integration of phase change materials in conjunction with air, liquid, and thermoelectric cooling techniques. These cooling methodologies hold immense promise in augmenting heat dissipation and averting overheating, thereby ensuring the attainment of optimal performance and prolonged lifespan for electronic devices.