One-to-Two Wireless Interchip Communication Link

Yazan Al-Alem; Ahmed A. Kishk; Raed M. Shubair

doi:10.1109/LAWP.2019.2926420

One-to-Two Wireless Interchip Communication Link

Yazan Al-Alem^*
, Ahmed A. Kishk
, Raed M. Shubair

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Abstract

Wireless interchip communication between adjacent ICs in extreme conditions of orthogonal antennas is studied. The use of soft/hard surfaces and symmetrical layers concepts is employed in a 1:2 wireless interchip communication link to improve the overall link budget. A Y-shaped 1:2 wireless interchip link is fabricated and tested. The simulated results are validated by measurements.

Original language	English
Article number	8753568
Pages (from-to)	2375-2378
Number of pages	4
Journal	IEEE Antennas and Wireless Propagation Letters
Volume	18
Issue number	11
DOIs	https://doi.org/10.1109/LAWP.2019.2926420
State	Published - Nov 2019
Externally published	Yes

Bibliographical note

Publisher Copyright:
© 2002-2011 IEEE.

Keywords

Electromagnetic bandgap structures
soft and hard surfaces
wireless inter/intrachip communication

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/LAWP.2019.2926420

Cite this

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title = "One-to-Two Wireless Interchip Communication Link",

abstract = "Wireless interchip communication between adjacent ICs in extreme conditions of orthogonal antennas is studied. The use of soft/hard surfaces and symmetrical layers concepts is employed in a 1:2 wireless interchip communication link to improve the overall link budget. A Y-shaped 1:2 wireless interchip link is fabricated and tested. The simulated results are validated by measurements.",

keywords = "Electromagnetic bandgap structures, soft and hard surfaces, wireless inter/intrachip communication",

author = "Yazan Al-Alem and Kishk, \{Ahmed A.\} and Shubair, \{Raed M.\}",

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year = "2019",

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doi = "10.1109/LAWP.2019.2926420",

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volume = "18",

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AU - Shubair, Raed M.

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AB - Wireless interchip communication between adjacent ICs in extreme conditions of orthogonal antennas is studied. The use of soft/hard surfaces and symmetrical layers concepts is employed in a 1:2 wireless interchip communication link to improve the overall link budget. A Y-shaped 1:2 wireless interchip link is fabricated and tested. The simulated results are validated by measurements.

KW - Electromagnetic bandgap structures

KW - soft and hard surfaces

KW - wireless inter/intrachip communication

UR - https://www.scopus.com/pages/publications/85075015461

U2 - 10.1109/LAWP.2019.2926420

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M3 - Article

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One-to-Two Wireless Interchip Communication Link

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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Cite this