Multipoint Thermal Sensing System for Power Semiconductor Devices Utilizing Fiber Bragg Gratings

This study investigates the feasibility of using fiber Bragg grating (FBG) sensors for multipoint thermal monitoring of several power semiconductor devices (PSDs), such as insulated gate bipolar transistors (IGBTs), and rectifiers assembled on a common heatsink in a three-phase inverter. A novel approach is proposed to integrate FBG sensors beneath the baseplates of the IGBT modules, avoiding the need for invasive modifications to the device structure. By strategically positioning multiple FBG sensors, accurate temperature profiles of critical components can be obtained. The experimental results demonstrate the effectiveness of the proposed method, with the temperature measurements from FBG sensors closely matching those obtained using thermal infrared (IR) cameras within ±1.1 °C. This research highlights the potential of FBG sensors for reliable and precise thermal management in power electronic systems, contributing to improved performance and reliability.