Modeling and placement of thermopiezoelectro-magnetic materials

There has been a vast interest in the general coupled field analysis of thermopiezoelectro-magnetic materials under which smart piezoelectric, thermopiezoelectric and magnetostrictive materials can be studied. The smart materials are often bonded as thin films on host structures for the purpose of sensing and/or actuation. It is well-known that the placement of sensors and actuators is important in order to obtain the appropriate sensor input and to provide the adequate actuation power. This study aims at modeling the important phenomenon of thermopiezoelectro-magnetism suitable for beam and/or plate type-host structures. The thermopiezoelectro-magnetic materials are modeled using the finite element method and the resulting equations are used for decision making on the best placement of the smart actuators on various host structures.