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Model for nano-scale bonding wires under thermal loading

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

In a companion paper, we studied the behavior of thick bonding wires under thermal loading and found good wire performance at elevated temperatures. This study extends the previous work to explore analyitcally the static stability of nano-scale bonding wires under thermal loading. Eringen nonlocal model is used to introduce nano-scale effects into Euler-Bernoulli beam theory, which is then employed to describe the wire response. Critical buckling loads and the amplitude of the static post-buckling nonlinear response are obtained. Numerical results show that taking the nano-scale effects into account leads to lower estimates of wire stiffness and buckling loads.

Original languageEnglish
Title of host publicationProceedings of the IEEE Conference on Nanotechnology
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages382-385
Number of pages4
ISBN (Electronic)9781479956227
DOIs
StatePublished - 26 Nov 2014
Externally publishedYes

Publication series

NameProceedings of the IEEE Conference on Nanotechnology
ISSN (Electronic)1944-9399

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

Keywords

  • Buckling
  • Nanowires
  • Nonlocal elasticity
  • Thermal loads

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Science Applications
  • Modeling and Simulation
  • Instrumentation

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