Abstract
In a companion paper, we studied the behavior of thick bonding wires under thermal loading and found good wire performance at elevated temperatures. This study extends the previous work to explore analyitcally the static stability of nano-scale bonding wires under thermal loading. Eringen nonlocal model is used to introduce nano-scale effects into Euler-Bernoulli beam theory, which is then employed to describe the wire response. Critical buckling loads and the amplitude of the static post-buckling nonlinear response are obtained. Numerical results show that taking the nano-scale effects into account leads to lower estimates of wire stiffness and buckling loads.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the IEEE Conference on Nanotechnology |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 382-385 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781479956227 |
| DOIs | |
| State | Published - 26 Nov 2014 |
| Externally published | Yes |
Publication series
| Name | Proceedings of the IEEE Conference on Nanotechnology |
|---|---|
| ISSN (Electronic) | 1944-9399 |
Bibliographical note
Publisher Copyright:© 2014 IEEE.
Keywords
- Buckling
- Nanowires
- Nonlocal elasticity
- Thermal loads
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Computer Science Applications
- Modeling and Simulation
- Instrumentation
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