Modal response of bonding wires under thermal loading

Resul Saritas; Mahmoud Khater; Hamidreza Nafissi; Sangtak Park; Turker Dagdelen; Eihab Abdel Rahman; Mustafa Yavuz

doi:10.1109/NANO.2014.6968139

Modal response of bonding wires under thermal loading

Resul Saritas, Mahmoud Khater, Hamidreza Nafissi, Sangtak Park, Turker Dagdelen, Eihab Abdel Rahman, Mustafa Yavuz

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This paper reports on the influence of thermal loading on the mechanical behavior of bonding wires. First, an experimental technique is developed to measure the quasi-static displacement of bonding wire. It is then deployed to measure the displacement, as well as peak temperature, of three different types of bonding wires to identify their loading conditions under DC current. An experimental technique is also developed and deployed to study of the modal response of bonding wires under thermal loads. Experimental results show a drop in the natural frequency of bonding wires with increased thermal loads. The experimental procedures developed here and applied to thick bonding wires offer a template for quasi-static and modal analysis of thin bonding wires under thermal loads at the micro- and nano-scales.

Original language	English
Title of host publication	Proceedings of the IEEE Conference on Nanotechnology
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	113-117
Number of pages	5
ISBN (Electronic)	9781479956227
DOIs	https://doi.org/10.1109/NANO.2014.6968139
State	Published - 26 Nov 2014
Externally published	Yes

Publication series

Name	Proceedings of the IEEE Conference on Nanotechnology
ISSN (Electronic)	1944-9399

Bibliographical note

Publisher Copyright:
© 2014 Crown.

Keywords

Bonding wires
Modal analysis

ASJC Scopus subject areas

Electrical and Electronic Engineering
Computer Science Applications
Modeling and Simulation
Instrumentation

Access to Document

10.1109/NANO.2014.6968139

Cite this

Saritas, R., Khater, M., Nafissi, H., Park, S., Dagdelen, T., Rahman, E. A., & Yavuz, M. (2014). Modal response of bonding wires under thermal loading. In Proceedings of the IEEE Conference on Nanotechnology (pp. 113-117). Article 6968139 (Proceedings of the IEEE Conference on Nanotechnology). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NANO.2014.6968139

@inproceedings{dcf4e9cfc90d479cb8323c3de01ac15e,

title = "Modal response of bonding wires under thermal loading",

abstract = "This paper reports on the influence of thermal loading on the mechanical behavior of bonding wires. First, an experimental technique is developed to measure the quasi-static displacement of bonding wire. It is then deployed to measure the displacement, as well as peak temperature, of three different types of bonding wires to identify their loading conditions under DC current. An experimental technique is also developed and deployed to study of the modal response of bonding wires under thermal loads. Experimental results show a drop in the natural frequency of bonding wires with increased thermal loads. The experimental procedures developed here and applied to thick bonding wires offer a template for quasi-static and modal analysis of thin bonding wires under thermal loads at the micro- and nano-scales.",

keywords = "Bonding wires, Modal analysis",

author = "Resul Saritas and Mahmoud Khater and Hamidreza Nafissi and Sangtak Park and Turker Dagdelen and Rahman, {Eihab Abdel} and Mustafa Yavuz",

note = "Publisher Copyright: {\textcopyright} 2014 Crown.",

year = "2014",

month = nov,

day = "26",

doi = "10.1109/NANO.2014.6968139",

language = "English",

series = "Proceedings of the IEEE Conference on Nanotechnology",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "113--117",

booktitle = "Proceedings of the IEEE Conference on Nanotechnology",

address = "United States",

}

Saritas, R, Khater, M, Nafissi, H, Park, S, Dagdelen, T, Rahman, EA & Yavuz, M 2014, Modal response of bonding wires under thermal loading. in Proceedings of the IEEE Conference on Nanotechnology., 6968139, Proceedings of the IEEE Conference on Nanotechnology, Institute of Electrical and Electronics Engineers Inc., pp. 113-117. https://doi.org/10.1109/NANO.2014.6968139

Modal response of bonding wires under thermal loading. / Saritas, Resul; Khater, Mahmoud; Nafissi, Hamidreza et al.
Proceedings of the IEEE Conference on Nanotechnology. Institute of Electrical and Electronics Engineers Inc., 2014. p. 113-117 6968139 (Proceedings of the IEEE Conference on Nanotechnology).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Modal response of bonding wires under thermal loading

AU - Saritas, Resul

AU - Khater, Mahmoud

AU - Nafissi, Hamidreza

AU - Park, Sangtak

AU - Dagdelen, Turker

AU - Rahman, Eihab Abdel

AU - Yavuz, Mustafa

PY - 2014/11/26

Y1 - 2014/11/26

N2 - This paper reports on the influence of thermal loading on the mechanical behavior of bonding wires. First, an experimental technique is developed to measure the quasi-static displacement of bonding wire. It is then deployed to measure the displacement, as well as peak temperature, of three different types of bonding wires to identify their loading conditions under DC current. An experimental technique is also developed and deployed to study of the modal response of bonding wires under thermal loads. Experimental results show a drop in the natural frequency of bonding wires with increased thermal loads. The experimental procedures developed here and applied to thick bonding wires offer a template for quasi-static and modal analysis of thin bonding wires under thermal loads at the micro- and nano-scales.

AB - This paper reports on the influence of thermal loading on the mechanical behavior of bonding wires. First, an experimental technique is developed to measure the quasi-static displacement of bonding wire. It is then deployed to measure the displacement, as well as peak temperature, of three different types of bonding wires to identify their loading conditions under DC current. An experimental technique is also developed and deployed to study of the modal response of bonding wires under thermal loads. Experimental results show a drop in the natural frequency of bonding wires with increased thermal loads. The experimental procedures developed here and applied to thick bonding wires offer a template for quasi-static and modal analysis of thin bonding wires under thermal loads at the micro- and nano-scales.

KW - Bonding wires

KW - Modal analysis

UR - http://www.scopus.com/inward/record.url?scp=84919483887&partnerID=8YFLogxK

U2 - 10.1109/NANO.2014.6968139

DO - 10.1109/NANO.2014.6968139

M3 - Conference contribution

AN - SCOPUS:84919483887

T3 - Proceedings of the IEEE Conference on Nanotechnology

SP - 113

EP - 117

BT - Proceedings of the IEEE Conference on Nanotechnology

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Modal response of bonding wires under thermal loading

Abstract

Publication series

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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Cite this