Microelectrochemical Deposition

In the twenty-first century, new microfabrication processes are being been investigated worldwide to build a microelectromechanical structure for microelectromechanical systems (MEMS) and bio-MEMS components such as gears, springs, helices, and columns; these are required for the apprehension of miniature micromachines that can access spaces never before explored by human beings. These components are generally produced by semiconductor processing technologies, like photolithography on a silicon substrate. The mechanical properties of silicon material are unsuited for applications such as microsurgery, biotechnology, fluidics, or high-temperature environments. Moreover, these processes require special and tremendously expensive facilities. On the other hand, due to tool wear and breakage problems, a tool-based machining process such as micromilling and drilling are not always suitable for microfabrication of MEMS and bio-MEMS structures. Among nonconventional machining processes, micro-EDM has some advantages over other processes in fabricating the 3D microstructure. In order to produce varieties of high-accuracy structures on machine, microelectrode fabrication is necessary to reduce the clamping error, which is one of the biggest challenges in the field of micro-EDM. This study shows an effective solution for overcoming the above challenges by introducing localized electrochemical deposition. This is one of the simplest, most inexpensive, and damage-free processes for fabricating various 3D microstructures as well as on-machine micro-EDM of noncircular electrodes.