Mechanically flexible optically transparent porous mono-crystalline silicon substrate

J. P. Rojas; A. Syed; M. M. Hussain

doi:10.1109/MEMSYS.2012.6170146

Mechanically flexible optically transparent porous mono-crystalline silicon substrate

J. P. Rojas^*, A. Syed, M. M. Hussain

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

22 Scopus citations

Abstract

For the first time, we present a simple process to fabricate a thin (≥5μm), mechanically flexible, optically transparent, porous mono-crystalline silicon substrate. Relying only on reactive ion etching steps, we are able to controllably peel off a thin layer of the original substrate. This scheme is cost favorable as it uses a low-cost silicon <100> wafer and furthermore it has the potential for recycling the remaining part of the wafer that otherwise would be lost and wasted during conventional back-grinding process. Due to its porosity, it shows see-through transparency and potential for flexible membrane applications, neural probing and such. Our process can offer flexible, transparent silicon from post high-thermal budget processed device wafer to retain the high performance electronics on flexible substrates.

Original language	English
Title of host publication	2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Pages	281-284
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2012.6170146
State	Published - 2012
Externally published	Yes

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

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10.1109/MEMSYS.2012.6170146

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Rojas, J. P., Syed, A., & Hussain, M. M. (2012). Mechanically flexible optically transparent porous mono-crystalline silicon substrate. In 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 (pp. 281-284). Article 6170146 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2012.6170146

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title = "Mechanically flexible optically transparent porous mono-crystalline silicon substrate",

abstract = "For the first time, we present a simple process to fabricate a thin (≥5μm), mechanically flexible, optically transparent, porous mono-crystalline silicon substrate. Relying only on reactive ion etching steps, we are able to controllably peel off a thin layer of the original substrate. This scheme is cost favorable as it uses a low-cost silicon <100> wafer and furthermore it has the potential for recycling the remaining part of the wafer that otherwise would be lost and wasted during conventional back-grinding process. Due to its porosity, it shows see-through transparency and potential for flexible membrane applications, neural probing and such. Our process can offer flexible, transparent silicon from post high-thermal budget processed device wafer to retain the high performance electronics on flexible substrates.",

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year = "2012",

doi = "10.1109/MEMSYS.2012.6170146",

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Rojas, JP, Syed, A & Hussain, MM 2012, Mechanically flexible optically transparent porous mono-crystalline silicon substrate. in 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012., 6170146, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 281-284. https://doi.org/10.1109/MEMSYS.2012.6170146

Mechanically flexible optically transparent porous mono-crystalline silicon substrate. / Rojas, J. P.; Syed, A.; Hussain, M. M.
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012. 2012. p. 281-284 6170146 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - For the first time, we present a simple process to fabricate a thin (≥5μm), mechanically flexible, optically transparent, porous mono-crystalline silicon substrate. Relying only on reactive ion etching steps, we are able to controllably peel off a thin layer of the original substrate. This scheme is cost favorable as it uses a low-cost silicon <100> wafer and furthermore it has the potential for recycling the remaining part of the wafer that otherwise would be lost and wasted during conventional back-grinding process. Due to its porosity, it shows see-through transparency and potential for flexible membrane applications, neural probing and such. Our process can offer flexible, transparent silicon from post high-thermal budget processed device wafer to retain the high performance electronics on flexible substrates.

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Mechanically flexible optically transparent porous mono-crystalline silicon substrate

Abstract

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ASJC Scopus subject areas

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