Abstract
A low-profile and wideband sub-THz absorber utilizing a thin resistive ruthenium oxide (RuO2) printing technique is proposed in this letter. The proposed absorber exhibits an absorption bandwidth from 108.2 to 171.1 GHz, which represents 45.04% with a profile of 0.076 λmax which is the free-space wavelength at the lowest frequency. The detailed manufacturing steps are presented along with step-by-step photographs of the fabricated sample. The fabricated prototype is validated by the free space measurement setup with good coherence to the simulated results. This invention is expected to provide a practical and concise solution for mitigating electromagnetic interference (EMI) in future sixth-generation (6G) devices.
Original language | English |
---|---|
Pages (from-to) | 580-582 |
Number of pages | 3 |
Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
Volume | 13 |
Issue number | 4 |
DOIs | |
State | Published - 1 Apr 2023 |
Bibliographical note
Publisher Copyright:© 2011-2012 IEEE.
Keywords
- Absorber
- low temperature co-fired ceramic (LTCC) fabrication
- low-profile
- sub-THz
- wideband
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
- Industrial and Manufacturing Engineering