Low-Profile Wideband D-Band Absorber Utilizing Resistive Thin-Film Screen-Printing

Youngno Youn, Ahmed Abdelmottaleb Omar, Daehyeon Kim, Suho Chang, Wonbin Hong*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

A low-profile and wideband sub-THz absorber utilizing a thin resistive ruthenium oxide (RuO2) printing technique is proposed in this letter. The proposed absorber exhibits an absorption bandwidth from 108.2 to 171.1 GHz, which represents 45.04% with a profile of 0.076 λmax which is the free-space wavelength at the lowest frequency. The detailed manufacturing steps are presented along with step-by-step photographs of the fabricated sample. The fabricated prototype is validated by the free space measurement setup with good coherence to the simulated results. This invention is expected to provide a practical and concise solution for mitigating electromagnetic interference (EMI) in future sixth-generation (6G) devices.

Original languageEnglish
Pages (from-to)580-582
Number of pages3
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume13
Issue number4
DOIs
StatePublished - 1 Apr 2023

Bibliographical note

Publisher Copyright:
© 2011-2012 IEEE.

Keywords

  • Absorber
  • low temperature co-fired ceramic (LTCC) fabrication
  • low-profile
  • sub-THz
  • wideband

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Fingerprint

Dive into the research topics of 'Low-Profile Wideband D-Band Absorber Utilizing Resistive Thin-Film Screen-Printing'. Together they form a unique fingerprint.

Cite this