Laser machining of different diameter holes in alumina ceramic: Thermal stress analysis

B. S. Yilbas*, S. S. Akhtar, C. Karatas

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Scopus citations

Abstract

Laser machining of different diameter holes into alumina tiles is carried out. Temperature and stress fields are predicted by using the finite element code. Surface temperature and residual stress predictions are validated through the thermocouple data and X-ray diffraction measurements. Morphological changes in the cutting section are examined by incorporating optical and scanning electron microscopes. It is found that the predictions of surface temperature and the residual stress formed at the cut section agree well with the experimental findings. In general, cut sections are free from large asperities; however, local dross attachments at the kerf edge and crack network formation at the kerf surface are observed.

Original languageEnglish
Pages (from-to)349-367
Number of pages19
JournalMachining Science and Technology
Volume20
Issue number3
DOIs
StatePublished - 2 Jul 2016

Bibliographical note

Publisher Copyright:
© 2016, © Taylor & Francis Group, LLC.

Keywords

  • Alumina
  • cutting
  • laser
  • stress
  • temperature

ASJC Scopus subject areas

  • General Materials Science
  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

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