Laser cutting of thin aluminum and silicon alloy: Influence of laser power on kerf width

B. S. Yilbas*, S. S. Akhtar, E. Bayraktar, Z. Gasem

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

9 Scopus citations

Abstract

Laser cutting of aluminum-silicon sheet is carried out. The influence of laser output power on the kerf width is examined in details. The lump parameter analysis is introduced to predict the kerf width size. The percentage of kerf width size variation due to different laser output power levels is formulated. It is found that the kerf width size predicted agrees well with the experimental data. The influence of laser output power on the kerf width size is more pronounced for power levels ≤ 350 W.

Original languageEnglish
Title of host publicationMaterials and Manufacturing Technologies XIV
Pages442-447
Number of pages6
DOIs
StatePublished - 2012

Publication series

NameAdvanced Materials Research
Volume445
ISSN (Print)1022-6680

Keywords

  • Aluminum-silicon
  • Kerf width
  • Laser cutting

ASJC Scopus subject areas

  • General Engineering

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