Laser cutting of small diameter holes into alumina tiles: Thermal stress analysis

Engineering

• Cutting Section 100%
• Diameter Hole 100%
• Thermal Stress Analysis 100%
• Alumina Tile 100%
• Residual Stress 100%
• Experimental Result 50%
• Cut Edge 50%
• Ray Diffraction Technique 50%
• Cut Surface 50%
• Stress Field 50%
• Optical Microscope 50%
• Finite Element Analysis 50%
• Scanning Electron Microscope 50%
• X Ray Diffraction 50%