Laser circular cutting of Kevlar sheets: Analysis of thermal stress filed and assessment of cutting geometry

B. S. Yilbas*, S. S. Akhtar, C. Karatas

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Scopus citations

Abstract

A Kevlar laminate has negative thermal expansion coefficient, which makes it difficult to machine at room temperaures using the conventional cutting tools. Contararily, laser machining of a Kevlar laminate provides advantages over the conventional methods because of the non-mechanical contact between the cutting tool and the workpiece. In the present study, laser circular cutting of Kevlar laminate is considered. The experiment is carried out to examine and evaluate the cutting sections. Temperature and stress fields formed in the cutting section are simulated in line with the experimental study. The influence of hole diameters on temperature and stress fields are investigated incorporating two different hole diameters. It is found that the Kevlar laminate cutting section is free from large size asperities such as large scale sideways burnings and attachemnt of charred residues. The maximum temperature along the cutting circumference remains higher for the large diameter hole than that of the small diameter hole. Temperature decay is sharp around the cutting section in the region where the cutting terminates. This, in turn, results in high temperature gradients and the thermal strain in the cutting region. von Mises stress remains high in the region where temperature gradients are high. von Mises stress follows similar to the trend of temperature decay around the cutting edges.

Original languageEnglish
Pages (from-to)180-189
Number of pages10
JournalOptics and Laser Technology
Volume96
DOIs
StatePublished - 1 Nov 2017

Bibliographical note

Publisher Copyright:
© 2017 Elsevier Ltd

Keywords

  • Circular cutting
  • Kevlar laminate
  • Laser cutting
  • Thermal stress

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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