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High-gain patch antennas loaded with high characteristic impedance superstrates

  • Hussein Attia*
  • , Leila Yousefi
  • , Omar Ramahi
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

32 Scopus citations

Abstract

It is shown that, under some resonance conditions, a microstrip patch antenna can be designed to achieve the highest possible gain when covered with a superstrate at the proper distance in free space. The transmission line analogy and the cavity model are used to deduce the resonance conditions required to achieve the highest gain. The resonance conditions include the condition on spacing between the antenna's substrate and the superstrate and the thickness of the superstrate. The permeability and permittivity of the superstrate are determined based on these resonant lengths and the appropriate characteristic impedance of each layer in this multilayered structure. The results are verified using both analytical and numerical methods. The effect of anisotropy of the superstrate is numerically investigated. The design criteria proposed here will reduce the total profile of the radiating system by 50% when compared to previous trends.

Original languageEnglish
Article number5986678
Pages (from-to)858-861
Number of pages4
JournalIEEE Antennas and Wireless Propagation Letters
Volume10
DOIs
StatePublished - 2011
Externally publishedYes

Bibliographical note

Funding Information:
Manuscript received June 19, 2011; revised July 21, 2011; accepted August 09, 2011. Date of publication August 18, 2011; date of current version September 01, 2011. This work was supported by the Ministry of Higher Education, Egypt, Research in Motion (RIM), Inc., and the Natural Sciences and Engineering Research Council (NSERC) of Canada under the NSERC/RIM Industrial Research Associate Chair and Discovery Programs.

Keywords

  • Anisotropy
  • artificial magnetic structures (AMS)
  • cavity model
  • patch antennas
  • transmission line (TL)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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