Abstract
The purpose of this paper is to reexamine the significance and nature of two-dimensional effects in fin assemblies. In particular, consideration is given to concerns expressed in the literature that the standard approach commonly leads to large errors due to two-dimensional effects. In addition, for the purpose of establishing a practical means of evaluating the level of significance of two-dimensional effects, an approximate first-order two-dimensional thermal circuit approach to analyzing heat transfer in fin assemblies is developed.
| Original language | English |
|---|---|
| Pages (from-to) | 748-752 |
| Number of pages | 5 |
| Journal | Journal of Heat Transfer |
| Volume | 121 |
| Issue number | 3 |
| DOIs | |
| State | Published - Aug 1999 |
Keywords
- Augmentation and Enhancement
- Finned surfaces
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
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