Abstract
Free form (physically flexible and stretchable) electronics can be used for applications which are unexplored today due to the rigid and brittle nature of the state-of-the-art electronics. Therefore, we show integration strategy to rationally design materials, processes and devices to transform advanced complementary metal oxide semiconductor (CMOS) electronics into flexible and stretchable one while retaining their high performance, energy efficiency, ultra-large-scale-integration (ULSI) density, reliability and performance over cost benefit to expand its applications for wearable, implantable and Internet-of-Everything electronics.
Original language | English |
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Title of host publication | 2015 IEEE International Electron Devices Meeting, IEDM 2015 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 19.4.1-19.4.4 |
ISBN (Electronic) | 9781467398930 |
DOIs | |
State | Published - 16 Feb 2015 |
Externally published | Yes |
Publication series
Name | Technical Digest - International Electron Devices Meeting, IEDM |
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Volume | 2016-February |
ISSN (Print) | 0163-1918 |
Bibliographical note
Publisher Copyright:© 2015 IEEE.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry