Abstract
A miniature microchannel heat sink with forced convection is an efficient way to dissipate the heat at a faster rate in electrical and electronic components. The vast majority of semiconductor-based electronic devices generate a considerable amount of waste heat. The conventional microchannel heat sinks are available in different profiles such as trapezoidal, rectangular, and triangular structures. In addition, the design variables and governing equation of the miniature heat sinks are presented herein.
Original language | English |
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Title of host publication | Fluid Mechanics and its Applications |
Publisher | Springer Science and Business Media B.V. |
Pages | 45-58 |
Number of pages | 14 |
DOIs | |
State | Published - 2022 |
Publication series
Name | Fluid Mechanics and its Applications |
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Volume | 131 |
ISSN (Print) | 0926-5112 |
ISSN (Electronic) | 2215-0056 |
Bibliographical note
Publisher Copyright:© 2022, The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.
ASJC Scopus subject areas
- Mechanics of Materials
- Mechanical Engineering
- Fluid Flow and Transfer Processes