Fatigue test for thick wire bonds

  • Turker Dagdelen
  • , Karim El-Rayes
  • , Sangtak Park
  • , Mahmoud Khater
  • , Resul Saritas
  • , Eihab Abdel-Rahman
  • , Mustafa Yavuz

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Thick bonding wires used in power modules experience a wide range of temperature and mechanical load cycling conditions. This leads to cracks at the wire heel due to fatigue. In this study, a new type of thick wire bonds, Aluminum coated copper, was subjected to fatigue test to investigate its durability. Unlike traditional thermal cycling, this test involves applying a pattern of repetitive prescribed displacements to a wire foot while fatigue failure is detected via a Wheatstone bridge. The aim is to compare different wire materials to the number-ofcycles-to-failure, thereby quantifying the reliability and life time of thick wire bond.

Original languageEnglish
Title of host publication26th Conference on Mechanical Vibration and Noise
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791846414
DOIs
StatePublished - 2014
Externally publishedYes

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
Volume8

Bibliographical note

Publisher Copyright:
Copyright © 2014 by ASME.

ASJC Scopus subject areas

  • Modeling and Simulation
  • Mechanical Engineering
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

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