Experimental residual stress mapping in bonded semiconductor devices
- D. Reiniger*
- , G. Horn
- , T. J. Mackin
- , J. R. Lesniak
- , Y. Zhong
- , Y. S. Chu
- , Z. C. Leseman
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review