Abstract
ETFE (Ethylene Tetra Fluoro Ethylene) is a lightweight polymer that is gradually gaining favor as an aesthetically pleasing building material, most commonly used by layering the foils to form 'pillows'. Widespread use of this material, however, is hindered by its poor thermal insulation properties. The heat transmission properties of ETFE can be altered by adding a thin coating of low-emissivity material on top of the foil, as is currently done with glass for windows. This paper presents a quantitative analysis of the change in the heat insulation capabilities of 3-layer ETFE pillows when low emissivity coatings are added to the different layers in various configurations. Dymola simulation was used to generate the results and the low-e coated pillows were found to possess thermal insulation properties on par with modern glass panels and much superior compared to uncoated 3-layer and even coated 2-layer pillows.
| Original language | English |
|---|---|
| Title of host publication | 2017 2nd International Conference for Convergence in Technology, I2CT 2017 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 993-997 |
| Number of pages | 5 |
| ISBN (Electronic) | 9781509043071 |
| DOIs | |
| State | Published - 18 Dec 2017 |
| Externally published | Yes |
| Event | 2nd International Conference for Convergence in Technology, I2CT 2017 - Pune, India Duration: 7 Apr 2017 → 9 Apr 2017 |
Publication series
| Name | 2017 2nd International Conference for Convergence in Technology, I2CT 2017 |
|---|---|
| Volume | 2017-January |
Conference
| Conference | 2nd International Conference for Convergence in Technology, I2CT 2017 |
|---|---|
| Country/Territory | India |
| City | Pune |
| Period | 7/04/17 → 9/04/17 |
Bibliographical note
Publisher Copyright:© 2017 IEEE.
Keywords
- Dymola
- ETFE
- U-value
- heat transmission
- low-e
- thermal insulation
ASJC Scopus subject areas
- Computer Science Applications
- Computer Networks and Communications
- Information Systems and Management
- Health Informatics
- Communication