Enhancement of toughness of SiC through compositing SiC-Al interpenetrating phase composites

  • Lu Xie
  • , Tingwei Sun
  • , Chenwei He
  • , Junchao Deng
  • , Honggang Yi
  • , Xiao Yang
  • , Qin Qin
  • , Qing Peng*
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

Silicon carbide has excellent properties such as high hardness and decomposition temperature, but its applications are limited by its poor toughness. Here, we investigate the enhancement of SiC's toughness by compositing silicon carbide-aluminum (SiC-Al) interpenetrating phase composites (IPCs) via molecular dynamics simulations. IPCs are a class of composites consisting of two or more phases that are topologically continuous and three-dimensionally interconnected through the microstructure. The Young's modulus and ultimate strength gradually increases with an increment of the volume fraction of SiC, opposite to the fracture strain. The interface between SiC and Al affects the mechanical properties of SiC-Al IPCs. When the volume fraction of SiC is less than 0.784, the attenuation rate of ultimate strength and fracture strain decreases. The attenuation rate increases when the volume fraction of SiC is more than 0.784. There are a minimum of ultimate strength and fracture strain at the 0.784, 0.7382 and 2.8610, respectively. The hardness of SiC-Al IPCs is about 48% of SiC. The change of SiC-Al IPCs hardness is more stable than that of SiC in the later stage of the nanoindentation test.

Original languageEnglish
Article number135706
JournalNanotechnology
Volume31
Issue number13
DOIs
StatePublished - 15 Jan 2020
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 2020 IOP Publishing Ltd.

Keywords

  • Interpenetrating phase composites
  • Mechanical properties
  • Molecular dynamics simulations
  • Nanoindentation
  • Silicon carbide-aluminum

ASJC Scopus subject areas

  • Bioengineering
  • General Chemistry
  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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