Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

Mohamed T. Ghoneim; Hossain M. Fahad; Aftab M. Hussain; Jhonathan P. Rojas; Galo A. Torres Sevilla; Nasir Alfaraj; Ernesto B. Lizardo; Muhammad M. Hussain

doi:10.1063/1.4938101

Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

Mohamed T. Ghoneim, Hossain M. Fahad, Aftab M. Hussain, Jhonathan P. Rojas, Galo A. Torres Sevilla, Nasir Alfaraj, Ernesto B. Lizardo, Muhammad M. Hussain^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

In today's digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical "through silicon" micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.

Original language	English
Article number	127115
Journal	AIP Advances
Volume	5
Issue number	12
DOIs	https://doi.org/10.1063/1.4938101
State	Published - 1 Dec 2015
Externally published	Yes

Bibliographical note

Publisher Copyright:
© 2015 Author(s).

ASJC Scopus subject areas

General Physics and Astronomy

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10.1063/1.4938101

Cite this

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title = "Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels",

abstract = "In today's digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical {"}through silicon{"} micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.",

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AU - Ghoneim, Mohamed T.

AU - Fahad, Hossain M.

AU - Hussain, Aftab M.

AU - Rojas, Jhonathan P.

AU - Torres Sevilla, Galo A.

AU - Alfaraj, Nasir

AU - Lizardo, Ernesto B.

AU - Hussain, Muhammad M.

PY - 2015/12/1

Y1 - 2015/12/1

N2 - In today's digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical "through silicon" micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.

AB - In today's digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical "through silicon" micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.

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Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

Abstract

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ASJC Scopus subject areas

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