Employing EBG in Wireless Inter-chip Communication Links: Design and Performance

Yazan Al-Alem; Ahmed A. Kishk; Raed M. Shubair

doi:10.1109/IEEECONF35879.2020.9330286

Employing EBG in Wireless Inter-chip Communication Links: Design and Performance

Yazan Al-Alem
, Ahmed A. Kishk
, Raed M. Shubair

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

This paper investigates the use of Electromagnetic bandgap (EBG) structures in wireless inter-chip communication links, EBG structures can be used to package open microstrip line baluns to suppress their radiation, and consequently enhance the overall wireless inter-chip link budget.

Original language	English
Title of host publication	2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1303-1304
Number of pages	2
ISBN (Electronic)	9781728166704
DOIs	https://doi.org/10.1109/IEEECONF35879.2020.9330286
State	Published - 5 Jul 2020
Externally published	Yes

Publication series

Name	2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

Keywords

Electromagnetic bandgap structures
soft and hard surfaces
wireless inter/intra-chip communication

ASJC Scopus subject areas

Computer Networks and Communications
Instrumentation

Access to Document

10.1109/IEEECONF35879.2020.9330286

Cite this

Al-Alem, Y., Kishk, A. A., & Shubair, R. M. (2020). Employing EBG in Wireless Inter-chip Communication Links: Design and Performance. In 2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings (pp. 1303-1304). Article 9330286 (2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEEECONF35879.2020.9330286

Al-Alem, Yazan ; Kishk, Ahmed A. ; Shubair, Raed M. / Employing EBG in Wireless Inter-chip Communication Links : Design and Performance. 2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2020. pp. 1303-1304 (2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings).

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title = "Employing EBG in Wireless Inter-chip Communication Links: Design and Performance",

abstract = "This paper investigates the use of Electromagnetic bandgap (EBG) structures in wireless inter-chip communication links, EBG structures can be used to package open microstrip line baluns to suppress their radiation, and consequently enhance the overall wireless inter-chip link budget.",

keywords = "Electromagnetic bandgap structures, soft and hard surfaces, wireless inter/intra-chip communication",

author = "Yazan Al-Alem and Kishk, \{Ahmed A.\} and Shubair, \{Raed M.\}",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE.",

year = "2020",

month = jul,

day = "5",

doi = "10.1109/IEEECONF35879.2020.9330286",

language = "English",

series = "2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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Al-Alem, Y, Kishk, AA & Shubair, RM 2020, Employing EBG in Wireless Inter-chip Communication Links: Design and Performance. in 2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings., 9330286, 2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 1303-1304. https://doi.org/10.1109/IEEECONF35879.2020.9330286

Employing EBG in Wireless Inter-chip Communication Links: Design and Performance. / Al-Alem, Yazan; Kishk, Ahmed A.; Shubair, Raed M.
2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2020. p. 1303-1304 9330286 (2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - This paper investigates the use of Electromagnetic bandgap (EBG) structures in wireless inter-chip communication links, EBG structures can be used to package open microstrip line baluns to suppress their radiation, and consequently enhance the overall wireless inter-chip link budget.

KW - Electromagnetic bandgap structures

KW - soft and hard surfaces

KW - wireless inter/intra-chip communication

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DO - 10.1109/IEEECONF35879.2020.9330286

M3 - Conference contribution

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T3 - 2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings

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Al-Alem Y, Kishk AA, Shubair RM. Employing EBG in Wireless Inter-chip Communication Links: Design and Performance. In 2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2020. p. 1303-1304. 9330286. (2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, IEEECONF 2020 - Proceedings). doi: 10.1109/IEEECONF35879.2020.9330286

Employing EBG in Wireless Inter-chip Communication Links: Design and Performance

Abstract

Publication series

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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Cite this