Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires

In this paper, a seed-layer approach to electrodeposition of Ni ₈₀Fe₂₀ on Cu wires was developed. First, different thicknesses of Ni₈₀Fe₂₀ were directly deposited onto the Cu wires by sputtering as a seed layer. A rotation L-holder fixture was used to hold the Cu wire during sputtering. Second, a relatively thick Ni ₈₀Fe₂₀ layer was deposited by electrodeposition onto the Cu wire with the seed layer by sputtering. The results of surface characterization on the composite wires with a seed layer showed that the surface uniformity was greatly improved, as compared to the surfaces of electrodeposited wires without a seed layer. A low coercivity of 0.5 Oe for the composite wire with a seed layer was achieved. The electrodeposited wires with seed layers performed an enhanced MI effect of 250%, in contrast to the MI effect of 160% as achieved by electrodeposited wires without a seed layer.