Abstract
Palladium addition does not suppress the anodic dissolution of Ti 230 plus 0. 15 Pd in seawater and hydrochloric acid. The addition of 0. 15 Pd, however, decreases anodic dissolution of Ti 230 plus 0. 15 Pd to some extent in H//2SO//4. Ti 230 appears to be more resistant to anodic dissolution on the whole and smaller current densities are required to keep the anodic dissolution to minimum in seawater and HCl. It may be too optimistic to use the term anodic passivation in view of the magnitude of the current densities. The mechanism of dissolution and reprecipitation of Pd** plus ** plus on titanium resulting in the formation of TiO//2 film appears to be confirmed by the results of this investigation.
| Original language | English |
|---|---|
| Pages | 15-17 |
| Number of pages | 3 |
| Volume | 46 |
| No | 1-2 |
| Specialist publication | Light Metal Age |
| State | Published - Feb 1988 |
| Externally published | Yes |
ASJC Scopus subject areas
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys
- Materials Chemistry
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