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Dry Sliding Wear and Microstructural Evolution of Hogonas + 50% WC Cladding Over SS410 Steel

  • Vikrant Singh
  • , Samandeep Kaur
  • , Anuj Bansal
  • , Deepak Kumar Goyal*
  • , Sarpreet Singh
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The purpose of this study was to develop a durable surface cladding capable of withstanding severe dry abrasive environments commonly experienced by SS410 stainless steel components. To achieve this, a composite cladding of Hogonas alloy reinforced with 50 wt% WC was fabricated via laser cladding and optimized for superior wear resistance and structural integrity. The coating exhibited a dense microstructure with uniformly distributed WC particles embedded in a Ni-based matrix, achieving an average hardness of around 698 HV, about four times that of SS410. Dry sliding wear tests, designed through a Central Composite Design (CCD) and analyzed using Response Surface Methodology (RSM), identified abrasive particle size as the most dominant factor, followed by sand flow rate and load. The cladding showed the gradual reduction in mass loss relative to the uncoated substrate. SEM analysis revealed a transition from ductile ploughing in the steel to brittle micro-fracture and carbide pull-out in the cladded surface.

Original languageEnglish
Pages (from-to)1691-1702
Number of pages12
JournalInternational Journal of Precision Engineering and Manufacturing
Volume27
Issue number4
DOIs
StatePublished - Apr 2026

Bibliographical note

Publisher Copyright:
© The Author(s), under exclusive licence to Korean Society for Precision Engineering 2026.

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 9 - Industry, Innovation, and Infrastructure
    SDG 9 Industry, Innovation, and Infrastructure

Keywords

  • Cladding
  • Dry sliding
  • Hogonas
  • SS410
  • WC

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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