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Digital image correlation and integration of artificial intelligence with infrared thermography for defect mapping in concrete

  • Salman Sajan
  • , Irfan Hanief
  • , Asad Hanif*
  • *Corresponding author for this work

Research output: Contribution to journal › Review article › peer-review

Abstract

Non-Destructive Testing (NDT) is critical for ascertaining the integrity, durability, and service life of concrete structures without causing any damage. This review paper explores various NDT methods, with a particular emphasis on digital image correlation (DIC) and the integration of artificial intelligence (AI) with infrared thermography for defect mapping. As an advanced optical technique, DIC delivers high-precision strain and crack analysis by capturing surface deformations through sophisticated imaging and data processing. Whereas DIC offers significant potential, its use in large-scale, field-based applications is still limited due to challenges related to cost, complex data interpretation, and the need for specialized expertise. Integrating AI with infrared thermography further facilitates defect mapping for improved service life assessment. The underlying principles, applications, strengths, and limitations are comprehensively examined, offering a clear comparison of their effectiveness in concrete evaluations. This comprehensive review clarifies how these NDT techniques complement each other, highlighting research gaps and opportunities for improvement. Such innovations pave the way for more robust and reliable practices in evaluating concrete structures, ultimately improving the safety and longevity of infrastructure.

Original languageEnglish
Article number114924
JournalOptics and Laser Technology
Volume199
DOIs
StatePublished - Jul 2026

Bibliographical note

Publisher Copyright:
© 2026 Elsevier Ltd

Keywords

  • Defect mapping
  • Digital image correlation
  • Infrared thermography
  • Non-destructive testing (NDT)
  • Service life assessment

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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