Creep and Dynamic mechanical analysis studies of peroxide-crosslinked ethylene-octene copolymer

Rajesh Theravalappil; Petr Svoboda; Sameepa Poongavalappil; Dagmar Svobodova

doi:10.1002/mame.201100289

Creep and Dynamic mechanical analysis studies of peroxide-crosslinked ethylene-octene copolymer

Rajesh Theravalappil
, Petr Svoboda^*
, Sameepa Poongavalappil
, Dagmar Svobodova

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

An ethylene-octene copolymer (EOC) (45 wt% octene) is crosslinked using dicumyl peroxide (DCP). Differential scanning calorimetry (DSC) reveals a very low melting temperature (50 °C). The network density is evaluated by gel content. While 0.2-0.3 wt% of peroxide leads only to a molecular weight increase (samples completely dissolved in xylene), 0.4-0.6 wt% of peroxide caused network formation. High-temperature creep was measured at 70, 120, and 200 °C at three stress levels. At 200 °C and above 0.6 wt% of peroxide, degradation due to chain scission is observed by rubber process analyzer (RPA) and is again supported by creep measurements. Residual strain at 70 °C is found to improve with increasing peroxide level. Dynamic mechanical analysis (DMA) reveals a strong influence of peroxide content on storage modulus and tan δ, in particular in the range 30-200 °C.

Original language	English
Pages (from-to)	761-767
Number of pages	7
Journal	Macromolecular Materials and Engineering
Volume	297
Issue number	8
DOIs	https://doi.org/10.1002/mame.201100289
State	Published - Aug 2012
Externally published	Yes

Keywords

DMA
creep
crosslinking
ethylene-octene copolymers
peroxides

ASJC Scopus subject areas

General Chemical Engineering
Organic Chemistry
Polymers and Plastics
Materials Chemistry

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10.1002/mame.201100289

Cite this

@article{32c691f5234a45c399db664b66a1a682,

title = "Creep and Dynamic mechanical analysis studies of peroxide-crosslinked ethylene-octene copolymer",

abstract = "An ethylene-octene copolymer (EOC) (45 wt\% octene) is crosslinked using dicumyl peroxide (DCP). Differential scanning calorimetry (DSC) reveals a very low melting temperature (50 °C). The network density is evaluated by gel content. While 0.2-0.3 wt\% of peroxide leads only to a molecular weight increase (samples completely dissolved in xylene), 0.4-0.6 wt\% of peroxide caused network formation. High-temperature creep was measured at 70, 120, and 200 °C at three stress levels. At 200 °C and above 0.6 wt\% of peroxide, degradation due to chain scission is observed by rubber process analyzer (RPA) and is again supported by creep measurements. Residual strain at 70 °C is found to improve with increasing peroxide level. Dynamic mechanical analysis (DMA) reveals a strong influence of peroxide content on storage modulus and tan δ, in particular in the range 30-200 °C.",

keywords = "DMA, creep, crosslinking, ethylene-octene copolymers, peroxides",

author = "Rajesh Theravalappil and Petr Svoboda and Sameepa Poongavalappil and Dagmar Svobodova",

year = "2012",

month = aug,

doi = "10.1002/mame.201100289",

language = "English",

volume = "297",

pages = "761--767",

journal = "Macromolecular Materials and Engineering",

issn = "1438-7492",

publisher = "Wiley-VCH Verlag",

number = "8",

}

TY - JOUR

T1 - Creep and Dynamic mechanical analysis studies of peroxide-crosslinked ethylene-octene copolymer

AU - Theravalappil, Rajesh

AU - Svoboda, Petr

AU - Poongavalappil, Sameepa

AU - Svobodova, Dagmar

PY - 2012/8

Y1 - 2012/8

N2 - An ethylene-octene copolymer (EOC) (45 wt% octene) is crosslinked using dicumyl peroxide (DCP). Differential scanning calorimetry (DSC) reveals a very low melting temperature (50 °C). The network density is evaluated by gel content. While 0.2-0.3 wt% of peroxide leads only to a molecular weight increase (samples completely dissolved in xylene), 0.4-0.6 wt% of peroxide caused network formation. High-temperature creep was measured at 70, 120, and 200 °C at three stress levels. At 200 °C and above 0.6 wt% of peroxide, degradation due to chain scission is observed by rubber process analyzer (RPA) and is again supported by creep measurements. Residual strain at 70 °C is found to improve with increasing peroxide level. Dynamic mechanical analysis (DMA) reveals a strong influence of peroxide content on storage modulus and tan δ, in particular in the range 30-200 °C.

AB - An ethylene-octene copolymer (EOC) (45 wt% octene) is crosslinked using dicumyl peroxide (DCP). Differential scanning calorimetry (DSC) reveals a very low melting temperature (50 °C). The network density is evaluated by gel content. While 0.2-0.3 wt% of peroxide leads only to a molecular weight increase (samples completely dissolved in xylene), 0.4-0.6 wt% of peroxide caused network formation. High-temperature creep was measured at 70, 120, and 200 °C at three stress levels. At 200 °C and above 0.6 wt% of peroxide, degradation due to chain scission is observed by rubber process analyzer (RPA) and is again supported by creep measurements. Residual strain at 70 °C is found to improve with increasing peroxide level. Dynamic mechanical analysis (DMA) reveals a strong influence of peroxide content on storage modulus and tan δ, in particular in the range 30-200 °C.

KW - DMA

KW - creep

KW - crosslinking

KW - ethylene-octene copolymers

KW - peroxides

UR - https://www.scopus.com/pages/publications/84864719413

U2 - 10.1002/mame.201100289

DO - 10.1002/mame.201100289

M3 - Article

AN - SCOPUS:84864719413

SN - 1438-7492

VL - 297

SP - 761

EP - 767

JO - Macromolecular Materials and Engineering

JF - Macromolecular Materials and Engineering

IS - 8

ER -

Creep and Dynamic mechanical analysis studies of peroxide-crosslinked ethylene-octene copolymer

Abstract

Keywords

ASJC Scopus subject areas

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