Abstract
A simplified analytical model for the computation of thermal conduction across rectangular-partitioned enclosures is investigated. The rectangular enclosures may contain solid or liquid with or without constant and uniformly distributed heat generation. The conduction in the enclosures is two-dimensional, whereas the one-dimensional conduction in the cell partitions is assumed. This analytical model leads to a closed-form solution for temperature distribution in the conductive region and the partitions. Dimensionless temperature contours of the enclosure are parametrically investigated by varying the aspect ratio of the enclosure, the ratio of thermal conductivities of the enclosure to the partition and the dimensionless heat generation term.
| Original language | English |
|---|---|
| Pages (from-to) | 509-521 |
| Number of pages | 13 |
| Journal | International Communications in Heat and Mass Transfer |
| Volume | 18 |
| Issue number | 4 |
| DOIs | |
| State | Published - 1991 |
ASJC Scopus subject areas
- Atomic and Molecular Physics, and Optics
- General Chemical Engineering
- Condensed Matter Physics