CNT-sandwiched copper composites as super thermal conductors for heat management

Due to outstanding electric conductance, copper is widely used as wires in electricity and as interconnects in microchips, where the thermal conductivity could be enhanced by compositing with carbon nanotubes (CNTs). Here, we have numerically designed a class of sandwich-like CNT/Cu/CNT nanotubes which possess high thermal conductivity revealed by molecular dynamics simulations. The enhancement factor of thermal conductivity of the composite using single-walled CNT is 37.5 times of that of a 5-nm-radius copper nanowire. The enhancement factor is further enlarged to 58.2 using triple-walled CNT in the outer side. The atomic stress analysis manifests that the thermal stresses are concentrated in the region around the CNT/Cu interface. The stabilities and larger enhancement factors at high temperatures imply high temperature applications of these CNT-sandwiched tubular copper nanocomposites in heat management and electronics.