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CMOS compatible strategy based on selective atomic layer deposition of a hard mask for transferring block copolymer lithography patterns

  • G. Gay*
  • , T. Baron
  • , C. Agraffeil
  • , B. Salhi
  • , T. Chevolleau
  • , G. Cunge
  • , H. Grampeix
  • , J. H. Tortai
  • , F. Martin
  • , E. Jalaguier
  • , B. De Salvo
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

32 Scopus citations

Abstract

A generic, CMOS compatible strategy for transferring a block copolymer template to a semiconductor substrate is demonstrated. An aluminum oxide (Al2O3) hard mask is selectively deposited by atomic layer deposition in an organized array of holes obtained in a PS matrix via PS-b-PMMA self-assembly. The Al2O3 nanodots act as a highly resistant mask to plasma etching, and are used to pattern high aspect ratio (>10) silicon nanowires and nanopillars.

Original languageEnglish
Article number435301
JournalNanotechnology
Volume21
Issue number43
DOIs
StatePublished - 29 Oct 2010
Externally publishedYes

ASJC Scopus subject areas

  • Bioengineering
  • General Chemistry
  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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