Abstract
CMOS-based neural tissue in-vivo recording chips with a purely capacitive interface are presented with 256 sites resp. 256 recording channels. A 3D post-CMOS ALD-based process allows to provide a highly efficient sensor dielectric and to realize a protective insulation layer for the non-Active part of the fabricated devices. A simple interconnect-efficient sensor array topology is used. Electrical characterizations and in-vivo measurements with biological content reveal proper operation of the presented approach.
| Original language | English |
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| Title of host publication | IEEE Biomedical Circuits and Systems Conference |
| Subtitle of host publication | Engineering for Healthy Minds and Able Bodies, BioCAS 2015 - Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9781479972333 |
| DOIs | |
| State | Published - 4 Dec 2015 |
| Externally published | Yes |
| Event | 11th IEEE Biomedical Circuits and Systems Conference, BioCAS 2015 - Atlanta, United States Duration: 22 Oct 2015 → 24 Oct 2015 |
Publication series
| Name | IEEE Biomedical Circuits and Systems Conference: Engineering for Healthy Minds and Able Bodies, BioCAS 2015 - Proceedings |
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Conference
| Conference | 11th IEEE Biomedical Circuits and Systems Conference, BioCAS 2015 |
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| Country/Territory | United States |
| City | Atlanta |
| Period | 22/10/15 → 24/10/15 |
Bibliographical note
Publisher Copyright:© 2015 IEEE.
Keywords
- CMOS
- atomic layer deposition
- capacitive interface
- dielectric
- in-vivo
- neural tissue recording
ASJC Scopus subject areas
- Biotechnology
- Instrumentation
- Biomedical Engineering
- Electrical and Electronic Engineering