Abstract
Today's mainstream flexible electronics research is geared towards replacing silicon either totally, by having organic devices on organic substrates, or partially, by transferring inorganic devices onto organic substrates. In this work, we present a pragmatic approach combining the desired flexibility of organic substrates and the ultra-high integration density, inherent in silicon semiconductor industry, to transform bulk/inflexible silicon into an ultra-thin mono-crystalline fabric. We also show the effectiveness of this approach in achieving fully flexible electronic systems. Furthermore, we provide a progress report on fabricating various memory devices on flexible silicon fabric and insights for completely flexible memory modules on silicon fabric.
Original language | English |
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Title of host publication | 8th International Conference on Electrical and Computer Engineering |
Subtitle of host publication | Advancing Technology for a Better Tomorrow, ICECE 2014 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 655-658 |
Number of pages | 4 |
ISBN (Electronic) | 9781479941667 |
DOIs | |
State | Published - 28 Jan 2015 |
Externally published | Yes |
Publication series
Name | 8th International Conference on Electrical and Computer Engineering: Advancing Technology for a Better Tomorrow, ICECE 2014 |
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Bibliographical note
Publisher Copyright:© 2014 IEEE.
Keywords
- electronic systems
- flexible electronics
- memory devices
- mono-crystalline silicon
- semiconductor industry
ASJC Scopus subject areas
- Control and Systems Engineering
- Electrical and Electronic Engineering