Abstract
Brain's stunning speed, energy efficiency and massive parallelism makes it the role model for upcoming high performance computation systems. Although human brain components are a million times slower than state of the art silicon industry components [1], they can perform 1016 operations per second while consuming less power than an electrical light bulb. In order to perform the same amount of computation with today's most advanced computers, the output of an entire power station would be needed. In that sense, to obtain brain like computation, ultra-fast devices with ultra-low power consumption will have to be integrated in extremely reduced areas, achievable only if brain folded structure is mimicked. Therefore, to allow brain-inspired computation, flexible and transparent platform will be needed to achieve foldable structures and their integration on asymmetric surfaces. In this work, we show a new method to fabricate 3D and planar FET architectures in flexible and semitransparent silicon fabric without comprising performance and maintaining cost/yield advantage offered by silicon-based electronics.
Original language | English |
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Title of host publication | Conference Proceedings - 10th Conference on Ph. D. Research in Microelectronics and Electronics, PRIME 2014 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9781479949946 |
DOIs | |
State | Published - 2014 |
Externally published | Yes |
Publication series
Name | Conference Proceedings - 10th Conference on Ph. D. Research in Microelectronics and Electronics, PRIME 2014 |
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Bibliographical note
Publisher Copyright:© 2014 IEEE.
Keywords
- 3D flexible electronics
- Field effect tranisistor
- Flexible electronics
- Mono-crystallline silicon
ASJC Scopus subject areas
- Electrical and Electronic Engineering