Research output: Patent
}
TY - PAT
T1 - Apparatus and Method for Controlling Laser Cutting Through Surface Plasma Monitoring
AU - Shuja, Shahzada
AU - Yilbas, Bekir
AU - Hawwa, Muhammad
PY - 2013
Y1 - 2013
M3 - Patent
M1 - US8546724
ER -