AI-Driven Resource and Communication-Aware Virtual Machine Placement Using Multi-Objective Swarm Optimization for Enhanced Efficiency in Cloud-Based Smart Manufacturing

Praveena Nuthakki, Pavan T. Kumar, Musaed Alhussein, Muhammad Shahid Anwar*, Khursheed Aurangzeb, Leenendra Chowdary Gunnam

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

Cloud computing has emerged as a vital platform for processing resource-intensive workloads in smart manufacturing environments, enabling scalable and flexible access to remote data centers over the internet. In these environments, Virtual Machines (VMs) are employed to manage workloads, with their optimal placement on Physical Machines (PMs) being crucial for maximizing resource utilization. However, achieving high resource utilization in cloud data centers remains a challenge due to multiple conflicting objectives, particularly in scenarios involving inter-VM communication dependencies, which are common in smart manufacturing applications. This manuscript presents an AI-driven approach utilizing a modified Multi-Objective Particle Swarm Optimization (MOPSO) algorithm, enhanced with improved mutation and crossover operators, to efficiently place VMs. This approach aims to minimize the impact on networking devices during inter-VM communication while enhancing resource utilization. The proposed algorithm is benchmarked against other multi-objective algorithms, such as Multi-Objective Evolutionary Algorithm with Decomposition (MOEA/D), demonstrating its superiority in optimizing resource allocation in cloud-based environments for smart manufacturing.

Original languageEnglish
Pages (from-to)4743-4756
Number of pages14
JournalComputers, Materials and Continua
Volume81
Issue number3
DOIs
StatePublished - 2024
Externally publishedYes

Bibliographical note

Publisher Copyright:
Copyright © 2024 The Authors. Published by Tech Science Press.

Keywords

  • Resource utilization
  • cloud computing
  • efficiency
  • inter VM communication
  • multi-objective optimization
  • smart manufacturing
  • virtual machine placement

ASJC Scopus subject areas

  • Biomaterials
  • Modeling and Simulation
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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