Abstract
Cu corrosion is a major issue affecting the structural integrity and efficient performance of Cu components in several applications. In recent years, the utilization of metal oxide thin films on copper components is fascinated cumulative consideration particularly in the field of energy and electronic related materials like micro-electromechanical, energy storage and memory device components. Herein, we report the use of a rapid and reproducible approach of aerosol-assisted (AA) CVD for depositing bimetallic nickel-vanadium oxide (NiVOx) thin films directly on Cu substrates. NiVOx coatings were produced by increasing the deposition period from 1 to 3 h at a fixed temperature of 480 °C and were structurally characterized through XRD analysis, XPS, SEM/EDS, and AFM. Detailed characterization was performed for the as-prepared amorphous NiVOx binary films having a compact and dense microstructure at an elemental stoichiometry of Ni/V in 1:1 ratio. Corrosion analyses, including electrochemical frequency modulation, Tafel plot analysis, and dynamic electrochemical impedance spectroscopy, were performed to assess the corrosion resistance performance of binary films on Cu substrates in saline medium. Moreover, scanning electrochemical microscopy was accomplished to estimate the electrochemical stability of the as-processed binary films during the 24-h immersion period in NaCl.
Original language | English |
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Article number | 127893 |
Journal | Colloids and Surfaces A: Physicochemical and Engineering Aspects |
Volume | 633 |
DOIs | |
State | Published - 20 Jan 2022 |
Bibliographical note
Publisher Copyright:© 2021
Keywords
- AACVD
- Corrosion
- NiVOx
- SECM
- Thin films
ASJC Scopus subject areas
- Surfaces and Interfaces
- Physical and Theoretical Chemistry
- Colloid and Surface Chemistry