TY - GEN
T1 - A standard approach for measuring adhesion energies in stiction-failed microdevices
AU - Leseman, Zayd C.
AU - Carlson, Steven
AU - Xue, Xiaojie
AU - Mackin, Thomas J.
PY - 2006
Y1 - 2006
N2 - We present results from a new procedure developed to quantify the pull-off force and strain energy release rates associated with stiction-failure in microdevices. The method is analogous to a standard, macro-scale peel test, but carried out using micro-scale devices. Adhesion is initiated by lowering an array of microcantilevers that protrude from a substrate into contact with a separate substrate. Displacement is controlled by a piezo-actuator with sub-run resolution while alignment is controlled using linear and tilt stages. An interferometric microscope is used to align the array and the substrate and to record deflection profiles and adhesion lengths during peel-off. This geometry is accurately modeled using linear elastic fracture mechanics, creating a robust, reliable, standard method for measuring adhesion energies in stiction-failed microdevices.
AB - We present results from a new procedure developed to quantify the pull-off force and strain energy release rates associated with stiction-failure in microdevices. The method is analogous to a standard, macro-scale peel test, but carried out using micro-scale devices. Adhesion is initiated by lowering an array of microcantilevers that protrude from a substrate into contact with a separate substrate. Displacement is controlled by a piezo-actuator with sub-run resolution while alignment is controlled using linear and tilt stages. An interferometric microscope is used to align the array and the substrate and to record deflection profiles and adhesion lengths during peel-off. This geometry is accurately modeled using linear elastic fracture mechanics, creating a robust, reliable, standard method for measuring adhesion energies in stiction-failed microdevices.
UR - https://www.scopus.com/pages/publications/85196539738
U2 - 10.1115/IMECE2006-14498
DO - 10.1115/IMECE2006-14498
M3 - Conference contribution
AN - SCOPUS:85196539738
SN - 0791837904
SN - 9780791837900
T3 - American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) MEMS
BT - Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Microelectromechanical Systems
PB - American Society of Mechanical Engineers (ASME)
T2 - 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
Y2 - 5 November 2006 through 10 November 2006
ER -