Abstract
The aim of current work is to evaluate thermo-electrical characteristics of graphene nanoplatelets Reinforced Composite (GNPRC) coupled with magneto-electro-elastic (MEE) face sheet. In this regard, a cylindrical smart nanocomposite made of GNPRC with an external MEE layer is considered. The bonding between the layers are assumed to be perfect. Because of the layer nature of the structure, the material characteristics of the whole structure is regarded as graded. Both mechanical and thermal boundary conditions are applied to this structure. The main objective of this work is to determine critical temperature and critical voltage as a function of thermal condition, support type, GNP weight fraction, and MEE thickness. The governing equation of the multilayer nanocomposites cylindrical shell is derived. The generalized differential quadrature method (GDQM) is employed to numerically solve the differential equations. This method is integrated with Deep Learning Network (DNN) with ADADELTA optimizer to determine the critical conditions of the current sandwich structure. This the first time that effects of several conditions including surrounding temperature, MEE layer thickness, and pattern of the layers of the GNPRC is investigated on two main parameters critical temperature and critical voltage of the nanostructure. Furthermore, Maxwell equation is derived for modeling of the MEE.
| Original language | English |
|---|---|
| Pages (from-to) | 81-99 |
| Number of pages | 19 |
| Journal | Advances in Nano Research |
| Volume | 12 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jan 2022 |
Bibliographical note
Publisher Copyright:© 2022 Techno-Press, Ltd
Keywords
- Critical temperature
- Critical voltage
- Deep learning network
- Graphene nanoplatelets
- Neural network
ASJC Scopus subject areas
- Biotechnology
- Catalysis
- Electronic, Optical and Magnetic Materials
- Ceramics and Composites
- Atomic and Molecular Physics, and Optics
- Mechanical Engineering
- Fluid Flow and Transfer Processes
- Electrical and Electronic Engineering